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US 11,906,799 B2Granted
Integration of power and optics through cold plates for delivery to electronic and photonic integrated circuits
AssigneeCisco Technology, Inc.
InventorJoel Richard Goergen
Life of this patent
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Abstract
In one embodiment, an apparatus includes an upper cold plate and a lower cold plate, at least one of the upper cold plate or the lower cold plate comprising an electrical or optical path extending therethrough, a substrate and die package interposed between the upper cold plate or the lower cold plate, and a connector coupled to one of the upper cold plate or the lower cold plate for transmitting power or an optical signal through the electrical or optical path to the substrate and die package.
Claims20
An apparatus comprising:
- an upper cold plate and a lower cold plate, each of the upper cold plate and the lower cold plate comprising at least one of an electrical path or an optical path extending therethrough;
- a substrate and die package interposed between the upper cold plate and the lower cold plate;
- and
- a power block,
- wherein an optical signal is delivered to or from the substrate and die package via the optical path extending through a first cold plate of the upper cold plate and the lower cold plate, and power is supplied to the substrate and die package via the electrical path extending through a second cold plate of the upper cold plate and the lower cold plate, and
- wherein the power block is configured to be inserted into the second cold plate and includes the electrical path that extends beyond an inner surface of the second cold plate to contact the substrate and die package.
3 more elements
An apparatus comprising:
- a first cold plate comprising an optical path extending therethrough;
- a second cold plate comprising an electrical path extending therethrough;
- a power block;
- and
- a substrate and die package comprising at least one electronic integrated circuit and at least one photonic integrated circuit, the substrate and die package interposed between the first cold plate and the second cold plate,
- wherein an optical signal is delivered to or from the substrate and die package via the optical path extending through the first cold plate and power is supplied to the substrate and die package via the electrical path extending through the second cold plate from a power delivery block inserted into the second cold plate, and
- wherein the power block is configured to be inserted into the second cold plate and includes the electrical path that extends beyond an inner surface of the second cold plate to contact the substrate and die package.
4 more elements
A method comprising:
- creating an electrical path and an optical path through a first cold plate and a second cold plate;
- positioning the first cold plate and the second cold plate on opposite sides of a substrate and die package;
- transmitting power through the electrical path to the substrate and die package;
- and
- transmitting an optical signal through the optical path to and from the substrate and die package.
2 more elements
Dependencies are inferred from the claim text.