End-face coupling structures underneath a photonic layer
AssigneeCisco Technology, Inc.
InventorsRoman Bruck, Gianlorenzo Masini
Life of this patent
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Abstract
A method includes providing a photonic wafer that includes an electrical layer and a layer disposed on a substrate. The layer includes at least one optical waveguide that is disposed between the electrical layer and the substrate. The method also includes removing a portion of the substrate underneath the at least one optical waveguide and forming an end-face coupler. A portion of the end-face coupler is within the removed portion of the substrate. The end-face coupler transmits an optical signal to, or receives an optical signal from, an external optical device.
Claims8
An apparatus, comprising:
- a photonic wafer comprising an electrical layer and a layer disposed on a substrate, wherein the layer comprises at least one optical waveguide that is disposed between the electrical layer and the substrate;
- and
- an end-face coupler, wherein a portion of the end-face coupler is within a portion of the substrate underneath the at least one optical waveguide, and wherein the end-face coupler is configured to direct an optical signal to or from the optical waveguide and comprises an optical interface for end-face coupling.
A method, comprising:
- providing a photonic wafer comprising at least one optical waveguide disposed on a substrate;
- removing a portion of the substrate underneath the at least one optical waveguide;
- depositing a material in the removed portion of the substrate;
- and
- patterning and etching the material to form an end-face coupler configured to transmit an optical signal from an external optical device to the at least one optical waveguide.
Dependencies are inferred from the claim text.