Semiconductor wafer evaluation apparatus and semiconductor wafer manufacturing method

A semiconductor wafer evaluation apparatus, comprising:

• a contact maker where a metal (Schottky electrode) liquefied at room temperature makes contact with a semiconductor wafer as an object to be evaluated;
• power supply means for applying a voltage to the contact maker via means for compensating for parasitic inductance and parasitic capacity;
• application control means for intermittently establishing an applied state of the voltage from the power supply means;
• evaluation means for evaluating a state of point defects of the semiconductor wafer based on a status of an electrostatic capacity of the semiconductor wafer during intermittent application of the voltage by the application control means;
• and photoirradiation means for performing irradiation with light having energy equal to or higher than a bandgap of the semiconductor wafer, and wherein the evaluation means evaluates the defects by minority carrier transient spectroscopy.