Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method

A micromechanical, comprising:

• a substrate including a front side and a rear side;
• a micromechanical sensor chip including a sensor area attached to the front side of the substrate;
• a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip, the capping unit surrounding the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip;
• and
• a mold package formed above the capping unit,
• wherein a through-opening in the substrate forms a media access opening to the cavity toward the rear side of the substrate.

A method for manufacturing a micromechanical sensor device, comprising the following steps:

• providing a substrate including a front side and a rear side;
• attaching a micromechanical sensor chip including a sensor area to the front side of the substrate;
• forming a capping unit attached to the front side of the substrate, which is formed at least partially by an ASIC chip, the capping unit surrounding the micromechanical sensor chip in such a way that a cavity closed toward the front side of the substrate is formed between the sensor area of the micromechanical sensor chip and the ASIC chip;
• and
• forming a mold package above the capping unit,
• wherein the ASIC chip partially covers the micromechanical sensor chip and includes a recess, which has a u-shaped edge area, which is directly attached to the front side of the substrate, and an open portion of the u-shaped edge area is attached directly to the micromechanical sensor chip.