Apparatus and methods of passive cooling electronic components

An electronic component heat dissipation apparatus comprising:

• a heat dissipation housing having a wall defining a chamber having an airflow inlet opening and an airflow outlet opening,
• the heat dissipation housing being aligned with at least one electronic component so as to define a thermal chimney through the chamber for the flow of heated air,
• the wall having a plurality of heat dissipation nozzles, each heat dissipation nozzle having an air inlet opening located within the internal wall and an air outlet opening located within the chamber, the diameter of the air inlet opening being greater than the diameter of the air outlet opening,
• whereby air is pushed and/or pulled through the plurality of heat dissipation nozzles into the chamber at an increasing velocity and mixing with the flow of heated air thereby increasing the velocity of the flow of heated air though the chamber.

A method of removing heat from electronic components, comprising the steps of:

• providing a heat dissipation housing having a wall defining internal chamber having an airflow inlet opening and an airflow outlet opening, the wall having a plurality of heat dissipation nozzles, each heat dissipation nozzle having an air inlet opening having an inlet diameter (Id) located within the wall and an air outlet opening having an outlet diameter (Od) located within the internal chamber, the inlet diameter being greater than the outlet diameter;
• and
• arranging the heat dissipation housing to align with at least one electronic component so as to define a thermal chimney through the internal chamber for the flow of air,
• whereby air heated by the at least one electronic component escapes out from the at least one electronic component through the internal chamber,
• whereby air is pulled through the plurality of heat dissipation nozzles into the internal chamber at an increasing velocity thereby increasing the velocity of the airflow though the internal chamber, thereby increasing the velocity of the heated air escaping from the at least one electronic component to cool the at least one electronic component during use.

A method of removing heat from electronic components, comprising the steps of:

• providing a heat dissipation housing having an external wall and an internal wall defining outer chamber therebetween, the internal wall defining internal chamber having an airflow inlet opening and an airflow outlet opening, the external wall having at least one air opening configured to allow air into the outer chamber, the internal wall having a plurality of heat dissipation nozzles, each heat dissipation nozzle having an air inlet opening having an inlet diameter (Id) located within the internal wall and an air outlet opening having an outlet diameter (Od) located within the internal chamber, the inlet diameter being greater than the outlet diameter;
• arranging the heat dissipation housing to align with at least one electronic component so as to define a thermal chimney through the internal chamber for the flow of air,
• whereby air heated by the at least one electronic component escapes out from the at least one electronic component through the internal chamber,
• whereby air is pulled through the plurality of heat dissipation nozzles into the internal chamber at an increasing velocity thereby increasing the speed of the airflow though the internal chamber, thereby increasing the velocity of the heated air escaping from the at least one electronic component to cool the at least one electronic component during use.