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US 11,901,262 B2Granted
Cooling solution including microchannel arrays and methods of forming the same
AssigneeIntel Corporation
InventorsNicholas Neal, Zhimin Wan, Shankar Devasenathipathy, Je-Young Chang
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Abstract
Embodiments include a cooling solution having a first array of fins, where the first array of fins extend vertically from the substrate, and where adjacent individual fins of the first array are separated from each other by a microchannel. A second array of fins extend vertically from the substrate, where a channel region is between the first array of fins and the second array of fins.
Claims16
A microelectronic cooling solution comprising:
- a substrate;
- a first array of fins, wherein the first array of fins extends vertically from the substrate, and wherein adjacent individual fins of the first array are separated from each other by a microchannel;
- and
- a second array of fins extending vertically from the substrate, wherein a channel region is between the first array of fins and the second array of fins, wherein a length of individual fins of the second array of fins is greater than twice a length of individual fins of the first array of fins.
1 more element
An assembly comprising:
- a substrate:
- a die comprising an integrated circuit, wherein the die is on the substrate;
- and
- a cooling solution thermally coupled to the die, the cooling solution comprising:
- a base;
- a first array of fins, wherein the first array of fins extends vertically from the base, and wherein individual fins of the first array of fins are separated from each other by a microchannel;
- and
- a second array of fins extending vertically from the base,
- wherein a channel region is between the first array of fins and the second array of fins, and wherein a length of individual fins of the second array of fins is greater than twice a length of individual fins of the first array of fins.
6 more elements
Dependencies are inferred from the claim text.