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US 11,901,197 B2Granted
Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsMasataka Gosho, Reijiro Yamanaka
Life of this patent
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Abstract
A substrate processing apparatus includes: a processing container to which a supercritical fluid is supplied, the processing container being configured to dry a substrate by replacing a drying liquid collected on the substrate with the supercritical fluid; a discharge line configured to discharge a mixed fluid containing the supercritical fluid and the drying liquid from an interior of the processing container; and a density detector configured to detect a density of the mixed fluid flowing through the discharge line.
Claims9
A substrate processing apparatus comprising:
- a processing container to which a supercritical fluid is supplied, the processing container being configured to dry a substrate by replacing a drying liquid collected on the substrate with the supercritical fluid;
- a discharge line configured to discharge a mixed fluid containing the supercritical fluid and the drying liquid from an interior of the processing container;
- a density meter installed in the discharge line and configured to detect a density of the mixed fluid flowing through the discharge line;
- a first circuitry configured to calculate a reference density which is a density of the supercritical fluid having a temperature and a pressure that are the same as a temperature and a pressure of the mixed fluid flowing through the discharge line;
- and
- a second circuitry configured to calculate a density difference between the density of the mixed fluid detected by the density meter and the reference density calculated by the first circuitry.
3 more elements
Dependencies are inferred from the claim text.