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US 11,901,149 B2Granted
Component that can be soldered in SMD technology and method for producing a component that can be soldered in SMD technology
AssigneeEndress + Hauser GmbH + Co. KG
InventorsBernd Strütt, Dietmar Birgel, Silke Czaja
Life of this patent
Estimating the term…
Abstract
An SMD-solderable component comprises a resistance element, a first contact element, and a second contact element, wherein the first contact element is connected with a first end section of the resistance element by means of a first soldered connection and the second contact element is connected with a second end section of the resistance element by means of a second soldered connection. At least one of the first soldered connection and the second soldered connection is a lead-free soldered connection that is made with a lead-free solder preform. Further disclosed is a method for producing an SMD-solderable component.
Claims14
A surface-mounted device (SMD)-solderable component for soldering to a circuit board of an electronics unit, comprising:
- a resistance element;
- a first contact element;
- a second contact element;
- a first lead-free solder preform;
- and
- a second lead-free solder preform,
- wherein the first solder preform and the second solder preform are each coated with a flux,
- wherein the first contact element and the second contact element are provided for soldering to contact areas provided on the circuit board,
- wherein the first contact element is connected with a first end section of the resistance element via a first lead-free soldered connection that is made with the first lead-free solder preform,
- wherein the second contact element is connected with a second end section of the resistance element via a second lead-free soldered connection that is made with the second lead-free solder preform,
- wherein each solder preform has a face in which a guide is present extending into the respective solder preform with a specified depth and serving for receiving the first end section or the second end section of the resistance element, and
- wherein the first end section is introduced into the guide of the first solder preform before the first soldered connection is made and the second end section is introduced into the guide of the second solder preform before the second soldered connection is made.
9 more elements
A method for producing an SMD-solderable component having a resistance element, a first contact element, and a second contact element, the method comprising:
- producing a first soldered connection via which a first end section of the resistance element is connected with the first contact element;
- and
- producing a second soldered connection via which a second end section of the resistance element is connected with the second contact element;
- wherein for producing the first soldered connection and the second soldered connection, a first lead-free solder preform is arranged between the first end section and the first contact element and a second lead-free solder preform is arranged between the second end section and the second contact element,
- wherein each solder preform is coated with a flux,
- wherein each solder preform has a face in which a guide is present extending into the respective solder preform with a specified depth and serving for receiving the first end section or the second end section of the resistance element, and
- wherein the method further comprises:
- introducing the first end section and the second end section, respectively, each into a guide of an associated solder preform before producing the first soldered connection and the second soldered connection.
5 more elements
An electronics unit, comprising:
- a circuit board, the circuit board including an SMD-solderable component, including:
- a resistance element;
- a first contact element;
- a second contact element;
- a first lead-free solder preform;
- and
- a second lead-free solder preform,
- wherein the first solder preform and the second solder preform are each coated with a flux,
- wherein the first contact element and the second contact element are provided for soldering to contact areas provided on the circuit board,
- wherein the first contact element is connected with a first end section of the resistance element via a first lead-free soldered connection that is made with the first lead-free solder preform,
- wherein the second contact element is connected with a second end section of the resistance element via a second lead-free soldered connection that is made with the second lead-free solder preform,
- wherein each solder preform has a face in which a guide is present extending into the respective solder preform with a specified depth and serving for receiving the first end section or the second end section of the resistance element,
- wherein the first end section is introduced into the guide of the first solder preform before the first soldered connection is made and the second end section is introduced into the guide of the second solder preform before the second soldered connection is made, and
- wherein the SMD-solderable component is soldered onto the contact areas provided on the circuit board.
11 more elements
A field device of automation technology, comprising:
- an electronics unit, including:
- a circuit board, the circuit board including an SMD-solderable component, including:
- a resistance element;
- a first contact element;
- a second contact element;
- a first lead-free solder preform;
- and
- a second lead-free solder preform,
- wherein the first solder preform and the second solder preform are each coated with a flux,
- wherein the first contact element and the second contact element are provided for soldering to contact areas provided on the circuit board,
- wherein the first contact element is connected with a first end section of the resistance element via a first lead-free soldered connection that is made with the first lead-free solder preform,
- wherein the second contact element is connected with a second end section of the resistance element via a second lead-free soldered connection that is made with the second lead-free solder preform,
- wherein each solder preform has a face in which a guide is present extending into the respective solder preform with a specified depth and serving for receiving the first end section or the second end section of the resistance element,
- wherein the first end section is introduced into the guide of the first solder preform before the first soldered connection is made and the second end section is introduced into the guide of the second solder preform before the second soldered connection is made, and
- wherein the SMD-solderable component is soldered onto the contact areas provided on the circuit board.
12 more elements
Dependencies are inferred from the claim text.