Treatment methods and solutions for improving adhesion of gold electroplating on metal surfaces
AssigneeHutchinson Technology Incorporated
InventorsPaul V. Pesavento, Collin M. Grove, Douglas P. Riemer
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Abstract
Treatment solutions and methods for improving adhesion of gold electroplating onto metal surfaces are provided herein. More specifically, the disclosure relates to micro-etching stainless steel surfaces using to remove any organic contamination and chromium oxide formed on the surface, neutralize and strip the surface of any iron content, and repassivate the surface with a thin chromium oxide layer, prior to gold electroplating of the stainless steel surfaces.
Claims12
A method of treating one or more stainless steel surfaces, comprising:
- etching at least a portion of one or more stainless steel surfaces with an etchant solution comprised of potassium permanganate (KMnO4) and sodium hydroxide (NaOH), the one or more stainless steel surfaces including a metal circuit layer disposed on the one or more stainless steel surfaces, wherein a concentration of the potassium permanganate in the etchant solution is between 0.1 M and 0.4 M, and the sodium hydroxide is added until the etchant solution has a pH greater than 12.5;
- exposing at least the portion of the one or more stainless steel surfaces to the etchant solution fora period of time between 1 second and 5 minutes and at a temperature between 5.0 and 85 degrees Celsius;
- subsequently neutralizing at least the portion of the one or more stainless steel surfaces with a neutralizer solution comprised of ascorbic acid and citric acid;
- repassivating at least the portion of the one or more stainless steel surfaces with a chromium oxide layer;
- and
- removing the chromium oxide layer using a plating surface treatment operation.
A method of electroplating gold onto one or more stainless steel surfaces, the method comprising:
- treating at least a portion of one or more surfaces of stainless steel by exposing each of the one or more surfaces of stainless steel to a solution comprising potassium permanganate (KMnO4) and sodium hydroxide (NaOH), the one or more surfaces of stainless steel including a metal circuit layer disposed on the one or more surfaces of stainless steel, wherein a concentration of the potassium permanganate in the etchant solution is between 0.1 M and 0.4 M, and the sodium hydroxide is added until the etchant solution has a pH greater than 12.5;
- exposing at least the portion of the one or more stainless steel surfaces to the etchant solution fora period of time between 1 second and 5 minutes and at a temperature between 5.0 and 85 degrees Celsius;
- subsequently neutralizing at least the portion of the one or more surfaces of stainless steel by exposing each of the one or more surfaces of stainless steel to a solution comprised of ascorbic acid and citric acid;
- exposing at least the portion of the one or more surfaces of stainless steel to an oxygen plasma cleaning process and a wet cleaning process solution;
- repassivating at least the portion of the one or more stainless steel surfaces with a chromium oxide layer;
- removing the chromium oxide layer using a plating surface treatment operation;
- immersing the one or more surfaces of stainless steel in a gold electroplating solution;
- and
- applying a voltage between an anode within the gold electroplating solution and at least the portion of the one or more surfaces of stainless steel to generate a current from the anode to at least the portion of the one or more surfaces of stainless steel to electroplate gold from the gold electroplating solution onto at least the portion of the one or more surfaces of stainless steel.
Dependencies are inferred from the claim text.