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US 11,898,260 B2Granted
Electroforming system and method
AssigneeUnison Industries, LLC
InventorsAshwini Sameer Wadhavkar, Dattu Guru Venkata Jonnalagadda, Rajapriyan Rajendran, Gordon C. Tajiri, Udaya Bhaskar Pamidimarri
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Abstract
An electroforming system and method for electroforming a component that includes a first housing and a second housing, where the second housing can define a conformable electroforming reservoir with a base structure that defines a fluid passage. The first housing can include a dissolution reservoir containing an electrolytic fluid that is fluidly coupled to the fluid passage of the second housing.
Claims20
A system for electroforming a component, comprising:
- a first housing forming a dissolution reservoir containing an electrolytic fluid;
- a first anode coupled to or at least partially located within the first housing;
- a power source electrically coupled to the first anode;
- and
- a second housing adapted to receive a component, located exterior of the first housing, the second housing comprising:
- a frame, wherein the frame includes at least one opening;
- a mesh coupled to the frame, to define a base structure having an interior and a periphery, wherein the mesh spans the at least one opening;
- an electrically insulating sheet covering at least a portion of the interior of the base structure and wherein the electrically insulating sheet defines a fluid passage, the component located in the fluid passage;
- and
- a set of apertures provided with the frame, the set of apertures fluidly coupled with the fluid passage and extending radially outward from the base structure.
7 more elements
Dependencies are inferred from the claim text.