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US 11,898,067 B2Granted
Reactive 2-component adhesive system in film form having improved heat-and-humidity resistance
AssigneeTesa SE
InventorsUwe Schümann, Clementine Pradier
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Abstract
The present invention relates to a reactive adhesive film comprising (a) a polymeric film-forming matrix, (b) at least one reactive monomer or reactive resin, and (c) a reagent selected from an initiator, in particular a radical initiator, or an activator, featuring enhanced heat-and-humidity resistance, and to a reactive 2-component adhesive system in film form for bonding diverse materials, such as, for example, metal, wood, glass and/or plastic material.
Claims20
A reactive adhesive film, comprising:
- (a) a polymeric film-forming matrix;
- (b) at least one reactive monomer or reactive resin;
- and
- (c) a reagent, wherein the reagent is at least an activator, the reagent optionally including one of an initiator or a radical initiator,
- wherein the at least one reactive monomer or reactive resin comprises at least a cyclic, non-aromatic, nitrogen-containing vinyl compound ;
- further wherein the only reactive component of the reactive adhesive film is (i) the at least one reactive monomer or reactive resin and (ii) the reagent.
3 more elements
Dependencies are inferred from the claim text.