Resin composition and article made therefrom
AssigneeElite Electronic Material (Kunshan) Co., Ltd.
InventorsChenyu Shen, Rongtao Wang, Xing He, Penghui Fu
Life of this patent
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AssigneeElite Electronic Material (Kunshan) Co., Ltd.
InventorsChenyu Shen, Rongtao Wang, Xing He, Penghui Fu
Estimating the term…
A resin composition includes the following components or a prepolymer thereof: (A) 100 parts by weight of a polyolefin; and (B) 10 parts by weight to 50 parts by weight of a compound of Formula (1) having a pH value of 10 or less. In Formula (1), n is an integer of 3 to 6, each Y and Z are independently selected from o-vinylphenoxy group and phenoxy group, and each Y and Z are not phenoxy group at the same time. The prepolymer is prepared by subjecting a mixture to a prepolymerization reaction, and the mixture at least comprises the component (A) and the component (B). An article is made from the resin composition. The article includes a prepreg, a resin film, a laminate or a printed circuit board and achieves improvements in one or more properties including resin filling uniformity, dissipation factor variation rate under heat, glass transition temperature, Z-axis ratio of thermal expansion, peeling strength and thermal resistance after moisture absorption.
A resin composition, comprising the following components or a prepolymer thereof:
An article made from a resin composition, the article comprising a prepreg, a resin film, a laminate or a printed circuit board, wherein:
Dependencies are inferred from the claim text.