Enclosed cavity structures

A method of making a micro-module structure, comprising:

• providing a substrate, the substrate comprising (i) a cavity in or on the substrate, the cavity having a cavity floor and one or more cavity walls, and (ii) substrate post protruding from the cavity floor;
• disposing a component on the substrate post, the component having a component top side and a component bottom side opposite the component top side, the component bottom side disposed on the substrate post, the component extending over at least one edge of the substrate post;
• providing one or more component electrodes disposed on the component;
• and
• providing a module source wafer comprising a patterned sacrificial layer comprising one or more sacrificial portions each adjacent to one or more anchors, wherein the one or more sacrificial portions are differentially etchable from the wafer and the substrate is disposed at least partially on one of the one or more sacrificial portions.