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US 11,897,756 B2Granted
Micromechanical device with contact pad
AssigneeRobert Bosch GmbH
InventorsJochen Reinmuth, Martin Rambach
Life of this patent
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Abstract
A micromechanical device that includes a MEMS substrate and a cap substrate that enclose at least one first cavity, with at least one contact pad that is situated outside the first cavity. A MEMS structure is situated in the first cavity and connected to the contact pad with the aid of a strip conductor, the strip conductor extending at least partially in the MEMS substrate. The contact pad is situated at a surface of the cap substrate.
Claims7
A micromechanical device, comprising:
- a MEMS substrate and a cap substrate that enclose at least one first cavity;
- at least one contact pad situated outside the first cavity;
- and
- a MEMS structure situated in the first cavity and connected to the contact pad using a strip conductor, the strip conductor extending at least partially in the MEMS substrate;
- wherein the contact pad is situated in a second cavity formed by the MEMS substrate and by the cap substrate,
- wherein the contact pad is situated at an inner surface of the cap substrate and adjoining an upper surface of the second cavity.
3 more elements
Dependencies are inferred from the claim text.