Frequency domain spatial packing for 3D fabrication
AssigneeInkbit, LLC
InventorsQiaodong Cui, Wojciech Matusik, Victor Rong
Life of this patent
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AssigneeInkbit, LLC
InventorsQiaodong Cui, Wojciech Matusik, Victor Rong
Estimating the term…
Arrangement of the parts, particularly addressing arrangement for 3D fabrication, makes use of spatial frequency domain representations of the parts, such that acceptable (or optionally desirable) relative locations (and optionally orientations) of a part relative to another part or an arrangement of multiple other parts makes use of spatial frequency domain representations of the parts. In some examples, acceptable relative locations may be defined as relative locations that do not result in parts spatially overlapping and/or maintain a desired (e.g., minimum, average, etc.) separation between parts.
A method for arranging a plurality of parts into a build volume for three-dimensional fabrication, the method comprising:
A method for arranging a plurality of parts into a build volume for three-dimensional fabrication, the method comprising:
A system for arranging a plurality of parts into a build volume for three-dimensional fabrication, the system comprising one or more hardware processors, and a storage for instructions for execution by said one or more hardware processors that when executed cause the system to:
A non-transitory machine-readable medium comprising instructions stored thereon, the instructions when executed by one or more hardware processors cause said processors to:
Dependencies are inferred from the claim text.