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US 11,897,080 B2Granted
Polishing apparatus
AssigneeEbara Corporation
InventorsMasashi Kabasawa, Yasuyuki Motoshima, Hisanori Matsuo, Keisuke Kamiki
Life of this patent
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Abstract
There is disclosed a polishing apparatus which can regulate a surface temperature of the polishing pad without causing a defect such as a scratch on a substrate such as a wafer. The polishing apparatus includes: a non-contact type pad-temperature regulating device; a pad-temperature measuring device. The pad-temperature measuring device is arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of a polishing table.
Claims13
A polishing apparatus, comprising:
- a polishing pad having a polishing surface,
- a polishing table configured to support the polishing pad;
- a polishing head configured to press a substrate against the polishing pad;
- a non-contact pad-temperature regulating device arranged above the polishing pad;
- a pad-temperature measuring device configured to measure a surface temperature of the polishing pad, the pad-temperature measuring device being arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of the polishing table;
- an atomizer configured to clean the polishing surface of the polishing pad;
- and
- a controller configured to control the pad-temperature regulating device based on the surface temperature of the polishing pad measured by the pad-temperature measuring device,
- wherein the pad-temperature measuring device is arranged on the downstream side of the pad-temperature regulating device and on an upstream side of the atomizer, and
- wherein when a region between the atomizer and the pad-temperature regulating device is defined as a temperature control stable region, the pad-temperature measuring device is arranged in the temperature control stable region, and the polishing head is arranged in a region outside the temperature control stable region.
7 more elements
A polishing apparatus, comprising:
- a polishing pad having a polishing surface
- a polishing table configured to support the polishing pad;
- a polishing head configured to press a substrate against the polishing pad;
- a non-contact pad-temperature regulating device arranged above the polishing pad;
- a pad-temperature measuring device configured to measure a surface temperature of the polishing pad, the pad-temperature measuring device being arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of the polishing table;
- and
- a controller configured to control the pad-temperature regulating device based on the surface temperature of the polishing pad measured by the pad-temperature measuring device,
- wherein the pad-temperature regulating device comprises a heating fluid nozzle configured to spray a heating fluid onto the surface of the polishing pad,
- wherein the pad-temperature regulating device comprises a suction nozzle configured to suck air near a surface of the polishing pad, and
- wherein the heating fluid nozzle comprises a plurality of supply ports arranged around a suction port of the suction nozzle so that the heating fluid flows toward the suction port of the suction nozzle.
7 more elements
Dependencies are inferred from the claim text.