Polishing apparatus, information processing system, polishing method, and computer-readable storage medium

A polishing apparatus that is capable of referring to a storage in which a machine learning model is stored, the machine learning model being learned using learning data in which a feature amount of a signal regarding a frictional force between a polishing member and a substrate in polishing or a feature amount of a temperature of the polishing member or the substrate in polishing is input, and data regarding a film thickness of the polished substrate or a parameter related to yield of a product included in the polished substrate is output, the apparatus comprising:

• a polishing table provided with the polishing member and configured to be rotatable;
• a polishing head facing the polishing table and configured to be rotatable, wherein the substrate is attachable to a surface facing the polishing table;
• a control unit configured to perform control to polish the substrate by pressing the substrate against the polishing member while rotating the polishing table and the polishing head having the substrate attached thereto;
• a processor configured to generate the feature amount from the signal regarding the frictional force between the polishing member and the substrate in polishing or the feature amount from the temperature of the polishing member or a target substrate in polishing, and output the data regarding the film thickness of the polished substrate or any of the parameters related to the yield of the product included in the polished substrate, as an estimated value, by inputting the generated feature amount to the learned machine learning model;
• and
• a film thickness measuring device configured to measure the film thickness of the substrate,
• wherein
• the processor
• controls the film thickness measuring device to measure a film thickness of the polished target substrate when the output estimated value satisfies a predetermined polishing deterioration condition, and
• controls the film thickness measuring device not to measure the film thickness of the polished target substrate when the output estimated value does not satisfy the predetermined polishing deterioration condition.