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US 11,897,077 B2Granted
Semiconductor manufacturing apparatus
AssigneeKioxia Corporation
InventorTsutomu Miki
Life of this patent
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Abstract
A semiconductor manufacturing apparatus includes a first top ring that is rotatable and configured to hold a wafer, a first turntable that is rotatable and has a polishing pad for performing polishing of a film formed on the wafer, a sound measuring unit (sensor) that measures a first sound generated during the polishing, and a first calculation unit (controller) that calculates a polishing amount of the film based on a first sound pressure of the first sound, a polishing amount per unit time of the polishing, and a time of the polishing.
Claims18
A semiconductor manufacturing apparatus comprising:
- a rotatable first top ring configured to hold a wafer having a film;
- a rotatable first turntable having a polishing pad arranged to perform polishing of the film;
- a sound sensor configured to measure a first sound generated during the polishing;
- and
- a controller configured to calculate a polishing amount of the film based on (i) a first sound pressure of the first sound, (ii) a polishing amount per unit time of the polishing, and (iii) an elapsed time of the polishing, wherein a prediction value of the polishing amount is determined based on the first sound pressure during polishing, a second sound pressure before polishing, and the polishing amount per unit time according to Equation (2),
- Prediction
-
- value
-
- of
-
- polishing
-
- amount
- =
- ∑
- t
- =
- 1
- n
- (
- ∫
- f
-
- 1
- f
- 2
- (
- Sound
-
- pressure
-
- during
-
- polishing
- -
- Sound
-
- pressure
-
- before
-
- polishing
- )
- ×
- Polishing
-
- amount
-
- per
-
- unit
-
- time
- )
- (
- 2
- )
55 more elements
Dependencies are inferred from the claim text.