Apparatus and method for processing substrate
AssigneeSemes Co., Ltd.
InventorYun Hwa Hong
Life of this patent
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AssigneeSemes Co., Ltd.
InventorYun Hwa Hong
Estimating the term…
Provided is an apparatus for processing a substrate. The apparatus for processing a substrate includes a base portion configured to provide a rotational force in a circumferential direction; a holding module located on the base portion and configured to hold the substrate; a nozzle module located above the base portion and configured to jet a chemical liquid onto the substrate on the holding module; and a scattering prevention module located on the base portion at a peripheral portion of the holding module and configured to, when the chemical liquid is scattered after being jetted onto the substrate, guide the scattered chemical liquid to be discharged, wherein the scattering prevention module guides the scattered chemical liquid with a variable movement caused by the rotational force.
An apparatus for processing a substrate, comprising:
An apparatus for processing a substrate, comprising:
Dependencies are inferred from the claim text.