Implantable lead location using ECAP

A method comprising:

• receiving, by processing circuitry, first information representative of a first evoked compound action potential (ECAP) signal sensed in response to a first control stimulus delivered to a first potential implant location adjacent to a spinal cord of a patient during an implantation placement procedure;
• receiving, by the processing circuitry, second information representative of a second ECAP signal in response to a second control stimulus delivered to a second potential implant location different from the first potential implant location and adjacent to the spinal cord of the patient during the implantation placement procedure;
• determining, by the processing circuitry, a first latency of the first ECAP signal and a second latency of the second ECAP signal;
• determining, by the processing circuitry, one of the first latency of the first ECAP signal or the second latency of the second ECAP signal having a lowest latency;
• selecting, by the processing circuitry and according to the lowest latency, one of the first potential implant location associated with the first ECAP signal or the second potential implant location associated with the second ECAP signal as a target position for implantation of the electrode array;
• and
• outputting, by the processing circuitry, an indication of the target position.

A computer readable medium comprising instructions that, when executed, cause processing circuitry to:

• receive a first input that an electrode array has been positioned in a first potential implant location adjacent to a spinal cord of a patient during an implantation placement procedure;
• control stimulation circuitry to deliver a first control stimulus to an electrode combination of the electrode array;
• receive, from the sensing circuitry, first information representative of a first evoked compound action potential (ECAP) signal sensed in response to the first control stimulus;
• receive a second input that the electrode array has moved from the first potential implant location to a second potential implant location different from the first location and adjacent to the spinal cord of the patient during the implantation placement procedure;
• control the stimulation circuitry to deliver a second control stimulus to the electrode combination of the electrode array positioned at the second location;
• receive, from the sensing circuitry, second information representative of a second ECAP signal in response to the second control stimulus;
• determine a first latency of the first ECAP signal and a second latency of the second ECAP signal;
• determine one of the first latency of the first ECAP signal or the second latency of the second ECAP signal having a lowest latency;
• select, according to the lowest latency, one of the first potential implant location associated with the first ECAP signal or the second potential implant location associated with the second ECAP signal as a target position for implantation of the electrode array;
• and
• output an indication of the target position.