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US 11,889,662 B1Granted
Thermal interface sandwich
AssigneeLunar Energy, Inc.
InventorsBozhi Yang, Charles Ingalz
Life of this patent
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Abstract
A thermal interface sandwich is disclosed, including: a thermally conductive solid with a first surface and a second surface; a first thermal interface that is applied to the first surface of the thermally conductive solid; and a second thermal interface that is applied to the second surface of the thermally conductive solid.
Claims12
A thermally conductive assembly, comprising:
- a thermally conductive solid with a first surface and a second surface;
- a first thermal interface that is applied to the first surface of the thermally conductive solid;
- and
- a second thermal interface that is applied to the second surface of the thermally conductive solid;
- wherein the thermally conductive solid and the second thermal interface are surrounded by a cavity in a heat sink;
- wherein a set of heat generating components are pinned against the first thermal interface by a gantry assembly, wherein the gantry assembly is fastened into the heat sink, wherein the gantry assembly extends over the set of heat generating components, and wherein the gantry assembly pushes a pin against a top surface of a respective heat generating component such that a bottom surface of the respective heat generating component is pushed against the first thermal interface.
3 more elements
Dependencies are inferred from the claim text.