Method of transferring micro-light emitting diodes

A method of transferring micro-light emitting diodes, the method comprising:

• preparing a transfer substrate comprising a first groove, a second groove, and a third groove;
• forming transfer induction films on the first groove, the second groove, and the third groove, the transfer induction films including a hydrophilic thin film;
• forming a transfer prevention film on the transfer induction films formed on the second groove and the third groove, the transfer prevention film including a hydrophobic thin film;
• transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light, by using the transfer induction film formed on the first groove;
• removing a first section of the transfer prevention film formed on the second groove;
• transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light, by using the transfer induction film formed on the second groove;
• removing a second section of the transfer prevention film formed on the third groove;
• and
• transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light, by using the transfer induction film formed on the third groove.