In-situ vapor injection thermal desorption device

An in-situ vapor injection thermal desorption device, comprising a sectional combined input head (1), several intermediate connectors (2) and a bottom protector (5) connected in series from top to bottom,

• wherein the in-situ vapor injection thermal desorption device further comprises several water-vapor coupling injection activation chips (3) selectively disposed below any of the intermediate connectors;
• the sectional combined input head (1) is provided with a high-pressure-gas inlet, several pairs of heat-transfer-oil inlets and heat-transfer-oil outlets, and several pairs of hot-water inlets and hot-water outlets;
• wherein a first high-pressure-gas through hole (201), several first heat-transfer-oil through holes (202), several second heat-transfer-oil through holes (203), several first hot-water through holes (204), and several second hot-water through holes (205) are disposed inside each intermediate connector and run therethrough from top to bottom;
• the first heat-transfer-oil through hole (202) and the second heat-transfer-oil through hole (203) adjacent to each other are communicated through a first connection hole (206), and the first hot-water through hole (204) and the second hot-water through hole (205) adjacent to each other are communicated through a second connection hole (207);
• wherein a second high-pressure-gas through hole (301), several third heat-transfer-oil through holes (302), several fourth heat-transfer-oil through holes (303), several third hot-water through holes (304) and several fourth hot-water through holes (305) are disposed inside each water-vapor coupling injection activation chip (3) and run therethrough from top to bottom;
• and several gas-liquid spraying holes (306) are uniformly and transversely arranged inside each water-vapor coupling injection activation chip (3);
• each gas-liquid spraying hole (306) has at least one outlet end and at least one inlet end, the at least one outlet end is disposed on a side of the water-vapor coupling injection activation chip (3), and the at least one inlet end is communicated with the second high-pressure-gas through hole (301);
• and a central portion of each gas-liquid spraying hole (306) is communicated with the third hot-water through hole (304) or fourth hot-water through hole (305);
• wherein the high-pressure-gas inlet, the first high-pressure-gas through hole (201) and the second high-pressure-gas through hole (301) are communicated with one another correspondingly;
• the heat-transfer-oil inlets, the first heat-transfer-oil through holes (202) and the third heat-transfer-oil through holes (302) are communicated with one another correspondingly;
• the heat-transfer-oil outlets, the second heat-transfer-oil through holes (203) and the fourth heat-transfer-oil through holes (303) are communicated with one another correspondingly;
• the hot-water inlets, the first hot-water through holes (204) and the third hot-water through holes (304) are communicated with one another correspondingly;
• and the hot-water outlets, the second hot-water through holes (205) and the fourth hot-water through holes (305) are communicated with one another correspondingly.