Sintering press for sintering electronic components on a substrate

A sintering press for sintering electronic components on a substrate, the sintering press comprising:

• a pressing unit comprising a plurality of controllable presser members for applying a sintering pressure to the electronic components to be sintered;
• a plurality of reaction elements, each reaction element of said plurality of reaction elements extending predominantly along an element axis parallel to a pressing axis of the sintering press between a first element end and a second element end, wherein the first element end forms a support plane for a respective substrate;
• an element plate suitable for slidably supporting the reaction elements, the reaction elements being arranged in a matrix in said element plate, each reaction element having the first element end protruding from said element plate;
• a heating circuit comprising heating elements embedded in a heating body placed around the element plate to bring the element plate to a sintering temperature;
• and
• a heat diffusion plate placed in contact with the heating body and extending onto the element plate between the reaction elements, the heat diffusion plate being made of a material having a higher thermal conductivity than the element plate.