Electroplating device and electroplating system

An electroplating system, comprising:

• an electroplating device comprising:
• an electroplating bath adapted to contain an electroplating solution in which a workpiece as a cathode is at least partially immersed;
• a plurality of groups of anodes including a first anode group and a second anode group, each group providing at least one metal required for electroplating, an electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes;
• a power supply device adapted to adjust the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy;
• and
• two partition walls separating the electroplating bath into an outer containing part and an inner containing part located inside the outer containing part, the first anode group is arranged in the inner containing part, the second anode group is arranged in the outer containing part, the partition walls are provided with a plurality of through holes to allow the electroplating solution in the outer containing part to flow into the inner containing part through the through holes;
• a tank into which the electroplating solution overflowing from the electroplating bath is adapted to flow;
• and
• a pump adapted to pump the electroplating solution in the tank to an inlet of a liquid spraying device through a pipe.

An electroplating device adapted to electroplate an alloy comprising a plurality of metals on a workpiece, the electroplating device comprising:

• an electroplating bath containing an electroplating solution in which the workpiece acting as a cathode is at least partially immersed;
• a plurality of groups of anodes including a first anode group and a second anode group, each group providing at least one metal required for electroplating, an electrolytic potential of at least one metal of the first anode group is higher than that of at least one metal of the second anode group;
• a power supply device adjusting the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy, including:
• a first current regulator regulating the current transmitted to the first anode group;
• and
• a second current regulator regulating the current transmitted to the second anode group;
• and
• a weak electrolysis device adapted to ensure that the second anode group immersed in the electroplating solution has a positive potential when the first anode group and the second anode group stop the electroplating operation, the weak electrolysis device includes a n auxiliary cathode and a third current regulator, the cathode of the third current regulator is connected to the auxiliary cathode, and the anode of the third current regulator is connected to the second anode group, the third current regulator supplying power to the second anode group as the second current regulator stops transmitting current to the second anode group, so that the second anode group has a positive potential to prevent the replacement reaction between the second anode group and the electro plating solution.