Wet cleaning of electrostatic chuck

A method of cleaning an electrostatic chuck, comprising:

• forming a plenum by coupling the electrostatic chuck to a mounting plate of a cleaning fixture, the mounting plate comprising a recessed surface and a bottom surface, the recessed surface and bottom surface disposed parallel to one another and in separate planes, the recessed surface partially defining a recess formed in the mounting plate,
• wherein the plenum is formed between the bottom surface and the recessed surface of the mounting plate,
• wherein a lower surface of the electrostatic chuck is on a side of the electrostatic chuck that is opposite to a substrate supporting surface,
• wherein the plenum is partially sealed by a seal disposed between and in contact with the bottom surface of the mounting plate and the lower surface of the electrostatic chuck;
• delivering gas through a gas port coupled to the plenum to achieve a plenum pressure in the plenum, a gas flow across a width of the lower surface of the electrostatic chuck, and a gas flow through a plurality of holes disposed through the electrostatic chuck;
• and
• cleaning the substrate supporting surface of electrostatic chuck with a chemical solution without the chemical solution penetrating into the plurality of holes and contacting features of the substrate supporting member.

A method of cleaning a surface of an electrostatic chuck, comprising:

• forming a plenum by coupling the electrostatic chuck to a mounting plate of a cleaning fixture, the mounting plate comprising a recessed surface and a bottom surface, the recessed surface and bottom surface disposed parallel to one another and in separate planes, the recessed surface partially defining a recess formed in the mounting plate,
• wherein the plenum is formed between the bottom surface and the recessed surface of the mounting plate,
• wherein a lower surface of the electrostatic chuck is on a side of the electrostatic chuck that is opposite to a substrate supporting surface,
• wherein the plenum is partially sealed by a seal disposed between and in contact with the bottom surface and the lower surface of the electrostatic chuck;
• delivering gas through a gas port coupled to the plenum to achieve a plenum pressure in the plenum, a gas flow across a width of the lower surface of the electrostatic chuck, and a gas flow through a plurality of holes disposed through the electrostatic chuck;
• and
• cleaning the substrate supporting surface of the electrostatic chuck with a chemical solution without the chemical solution penetrating into the plurality of holes and contacting features of the electrostatic chuck, wherein the mounting plate is inert to the chemical solution.