Material design of EMI optimized shielding on integrated power electronics

An integrated power electronic module, comprising:

• packaging including an electromagnetic interference shielding composite including:
• a polymer substrate formed into a shape of a packaging component,
• an electromagnetic interference layer contacting the polymer substrate, wherein the electromagnetic interference layer exhibits a thickness in a range of 2 micrometers to 100 micrometers and the electromagnetic interference layer includes grains having a size in a range of 10 nanometers to 20 micrometers, and
• a conductive coating contacting the electromagnetic interference layer;
• and
• electronics housed within the packaging.

A method of forming an electromagnetic interference shielding composite for an integrated power electronic module, comprising:

• molding a polymer substrate into a shape of a packaging component;
• forming an electromagnetic interference layer on the polymer substrate, wherein the electromagnetic interference layer exhibits a thickness in a range of 2 micrometers to 100 micrometers and the electromagnetic interference layer includes grains having a size in a range of 10 nanometers to 20 micrometers;
• and
• forming a conductive coating on the electromagnetic interference layer.