Method for manufacturing an electronic component
AssigneeInfineon Technologies AG
InventorsMarkus Meyer, Jorge Eduardo Adatti Estevez, Alexandra Marina Roth
Life of this patent
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Abstract
A method for manufacturing an electronic component includes providing a substrate and a functional layer supported by the substrate; forming a structured protection layer on a side of the substrate to which the functional layer is attached, wherein the structured protection layer has a recess so that a portion of the functional layer is exposed; applying a dispersion comprising a solvent and electrically conductive components to the exposed portion of the functional layer so that the recess is at least partially filled with the dispersion; drying the dispersion in order to create an electrically conductive layer; and removing the structured protection layer.
Claims15
A method for manufacturing an electronic component, the method comprises:
- providing a substrate and a functional layer supported by the substrate, wherein the functional layer comprises a contact arrangement and a ventilation opening;
- forming a structured protection layer on a side of the substrate, to which the functional layer is attached to, wherein the structured protection layer has one or more recesses so that one or more portions of the functional layer are exposed;
- applying a dispersion comprising a solvent and electrically conductive components to at least one of the exposed portions of the functional layer so that at least one of the recesses is at least partially filled with the dispersion;
- drying the dispersion in order to create an electrically conductive layer;
- removing the structured protection layer;
- applying a sacrificial layer to the functional layer before forming the structured protection layer;
- wherein the step of forming the structured protection layer comprises:
- forming the structured protection layer on the sacrificial layer, wherein, in each of the recesses of the structured protection layer, one portion of the sacrificial layer is exposed;
- and
- removing the exposed portions of the sacrificial layer after the structured protection layer is formed on the sacrificial layer, wherein the exposed portions are removed only over a portion of the contact arrangement and over the ventilation opening.
Dependencies are inferred from the claim text.