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US 11,702,373 B2Granted
Gypsum wallboard with enhanced fire resistance, and related coatings and methods
AssigneeUnited States Gypsum Company
InventorsQinghua Li, Naser Aldabaibeh, Mark Hemphill, Trevor Rische, Suman Sinha Ray
Life of this patent
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Abstract
Disclosed are an organic binder-based coating; a composite gypsum board containing face and back cover sheets, an outside surface of the back cover sheet bearing the coating; and a method of preparing composite board where the back cover sheet contains the coating on its outer surface. The coating is formed from a composition comprising an alkaline silicate, a solid filler, and optionally, a borate. An enhancing layer can also be applied to the back cover sheet.
Claims18
A gypsum board comprising:
- a gypsum layer disposed between a face and back cover sheet, the gypsum layer comprising set gypsum;
- a coating disposed on an outer surface of the back cover sheet, the coating formed from a composition comprising an alkaline silicate, a solid filler, and optionally a borate;
- an enhancing layer disposed, directly or indirectly, on the outer surface of the back cover sheet, the enhancing layer formed from a composition comprising a mild acidic material in aqueous solution and a second solid filler additive, the mild acid material containing calcium chloride, aluminum sulfate, phosphoric acid, aluminum chloride, magnesium chloride, acetic acid, or any combination thereof and the second solid filler additive containing mica, clay, wollastonite, magnesite, perlite, talc, bentonite, limestone, gypsum, zinc oxide, zinc sulfate, hollow beads, zeolites, fly ash, bottom ash, coal ash, steel slag, iron slag, limestone slag, or any combination thereof, wherein the coating and the enhancing layer are in either order relative to the gypsum layer;
- the gypsum board having a High Temperature Shrinkage (S) of about 10% or less in the z direction when heated to about 1560° F. (850° C.), according to ASTM C1795-15 when the board is tested at a thickness of ⅝ (0.625) inch.
1 more element
A gypsum board comprising:
- a gypsum layer disposed between a face and back cover sheet, the gypsum layer comprising set gypsum;
- a coating disposed on an outer surface of the back cover sheet, the coating formed from a composition comprising an alkaline silicate, a solid filler, and optionally a borate;
- the gypsum board having a High Temperature Shrinkage (S) of about 10% or less in the x-y directions (width-length) when heated to about 1560° F. (850° C.) according to ASTM C1795-15 when the board is tested at a thickness of ⅝ (0.625) inch.
A method of making gypsum board comprising:
- (a) mixing at least water and stucco to form a slurry;
- (b) disposing the slurry between a face cover sheet and a back cover sheet to form a board precursor;
- (c) cutting the board precursor into a board;
- (d) drying the board;
- and
- (e) applying a coating composition on an outer surface of the back cover sheet, the coating composition comprising an alkaline silicate, a solid filler, and optionally a borate;
- (f) applying an enhancing layer directly or indirectly on the outer surface of the back cover sheet, the enhancing layer formed from a composition comprising a mild acidic material in aqueous solution and a second solid filler additive, the mild acid material containing calcium chloride, aluminum sulfate, phosphoric acid, aluminum chloride, magnesium chloride, acetic acid, or any combination thereof;
- and the second solid filler additive containing mica, clay, wollastonite, magnesite, perlite, talc, bentonite, limestone, gypsum, zinc oxide, zinc sulfate, hollow beads, zeolites, fly ash, bottom ash, coal ash, steel slag, iron slag, limestone slag, or any combination thereof, wherein the coating and the enhancing layer are in either order relative to the gypsum layer;
- wherein the gypsum board has at least one of the following when the board is tested at a thickness of ⅝ (0.625) inch:
- a High Temperature Shrinkage (S) of about 10% or less in the z direction when heated to about 1560° F. (850° C.), according to ASTM C1795-15;
- a High Temperature Shrinkage (S) of about 10% or less in the x-y directions (width-length) when heated to about 1560° F. (850° C.) according to ASTM C1795-15;
- a Thermal Insulation Index (TI) of about 20 minutes or greater according to ASTM C1795-15;
- a High Temperature Thickness Expansion in the z direction of at least about 0.1% when thickness is evaluated according to the analogous techniques and methodology of ASTM C1795-15;
- and/or
- where, when the board is cast at a nominal thickness of ⅝-inch, an assembly is constructed in accordance with any one of UL Design Numbers U305, U419 or U423, the assembly having a first side with a single layer of gypsum boards and a second side with a single layer of gypsum boards, and surfaces of gypsum boards on the first side of the assembly are heated in accordance with the time-temperature curve of ASTM E119-09a, while surfaces of gypsum boards on the second side of the assembly are provided with temperature sensors pursuant to ASTM E119-09a, the gypsum boards inhibit the transmission of heat through the assembly such that:
- a maximum single value of the temperature sensors is less than about 325° F. plus ambient temperature after about 60 minutes;
- or an average value of the temperature sensors is less than about 250° F. plus ambient temperature after about 60 minutes.
14 more elements
Dependencies are inferred from the claim text.