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US 11,688,614 B2Granted
Mitigating thermal expansion mismatch in temperature probe construction apparatus and method
AssigneeKLA Corporation
InventorsFarhat A. Quli, Razieh Mahzoon, Ran Liu
Life of this patent
Estimating the term…
Abstract
A process condition sensing apparatus is disclosed. The apparatus includes a substrate and an electronic enclosure including one or more electronic components. The apparatus includes a floating connection assembly configured to mechanically couple the electronic enclosure to the substrate, the floating connection assembly includes a leg and a foot. The leg or foot are arranged to mitigate thermal stress between one or more interfaces. The one or more interfaces include a leg-enclosure interface or a foot-substrate interface.
Claims20
A process condition sensing apparatus, comprising:
- a substrate;
- an electronic enclosure, wherein one or more electronic components are disposed within the electronic enclosure;
- and
- a floating connection assembly configured to mechanically couple the electronic enclosure to the substrate, wherein the floating connection assembly includes a leg and a foot, wherein at least one of the leg or foot are arranged to mitigate thermal stress between one or more interfaces, wherein the one or more interfaces comprises at least one of a leg-enclosure interface or a foot-substrate interface,
- wherein the floating connection assembly includes a retainer, wherein the retainer is arranged to overlap with the foot in a direction along the surface of the substrate and wherein the retainer is arranged to provide a gap between the foot and the retainer in a direction perpendicular to the surface of the substrate, wherein the gap mitigates thermal stress at the foot-substrate interface.
2 more elements
A process condition sensing apparatus, comprising:
- a substrate;
- an electronic enclosure, wherein one or more electronic components are disposed within the electronic enclosure;
- and
- a floating connection assembly configured to mechanically couple the electronic enclosure to the substrate, wherein the floating connection assembly includes a leg and a foot, wherein the leg and foot are arranged to mitigate thermal stress between a leg-enclosure interface and a foot-substrate interface,
- wherein the leg comprises a securing section, a top cap, and a bottom cap, wherein the securing section passes through a portion of the electronic enclosure and wherein the top cap and bottom cap secure the electronic enclosure to the securing section, wherein the securing section is sized to provide a gap between the securing section and an internal channel wall of the electronic enclosure, wherein the gap mitigates thermal stress at the leg-enclosure interface,
- wherein the floating connection assembly includes a retainer, wherein the retainer is arranged to overlap the foot in a direction along the surface of the substrate and wherein the retainer is arranged to provide a gap between the foot and the retainer in a direction perpendicular to the surface of the substrate, wherein the gap mitigates thermal stress at the foot-substrate interface.
3 more elements
A method, comprising:
- providing a substrate;
- securing an electronic enclosure to the substrate via a floating connection assembly, the floating connection assembly configured to mechanically couple the electronic enclosure to the substrate, wherein the floating connection assembly includes a leg and a foot, wherein the leg and foot are arranged to mitigate thermal stress between a leg-enclosure interface and a foot-substrate interface;
- securing the electronic enclosure to the leg, wherein the leg comprises a securing section, a top cap, and a bottom cap, wherein the securing section passes through a portion of the electronic enclosure and wherein the top cap and bottom cap secure the electronic enclosure to the securing section, wherein the securing section is sized to provide a gap between the securing section and an internal channel wall of the electronic enclosure, wherein the gap mitigates thermal stress at the leg-enclosure interface;
- and
- securing the foot to the substrate, wherein the floating connection assembly includes a retainer, wherein the retainer is arranged to overlap the foot in a direction along the surface of the substrate and wherein the retainer is arranged to provide a gap between the foot and the retainer in a direction perpendicular to the surface of the substrate, wherein the gap mitigates thermal stress at the foot-substrate interface.
2 more elements
Dependencies are inferred from the claim text.