Aqueous electroless nickel plating bath and method of using the same
AssigneeMacDermid Acumen, Inc.
InventorsRobert Janik, Nicole J. Micyus, Ryan Schuh
Life of this patent
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Abstract
An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.
Claims14
A method of producing an electroless nickel phosphorus deposit on a substrate, wherein the electroless nickel phosphorus deposit has a phosphorus content of about 12%, the method comprising the steps of:
- contacting the substrate with an electroless nickel phosphorus plating solution comprising:
- a) a source of nickel ions;
- b) a reducing agent comprising a hypophosphite;
- c) a chelation system comprising:
- i) one or more dicarboxylic acids;
- and
- ii) one or more alpha hydroxy carboxylic acids;
- and
- d) a brightener comprising bismuth;
- for a period of time to provide a nickel phosphorus deposit on the substrate having a phosphorus content of about 12%;
- wherein the electroless nickel phosphorous plating solution has a lifetime and produces a nickel phosphorous deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel phosphorous plating solution
- wherein the electroless nickel phosphorous plating solution deposits the nickel phosphorous deposit on the substrate at rate of at least 0.6 mil/hour.
Dependencies are inferred from the claim text.