Substrate processing apparatus, storage medium and substrate processing method

A substrate processing apparatus comprising:

• a device for subjecting a substrate to processing;
• and
• a controller, the controller including a processor communicatively coupled to a computer-readable storage medium that
• stores a plurality of first tables and at least one second table, each first table including aa plurality of first modification values, and the at least one second table including a plurality of second modification values, the first modification values and the second modification values each varying independently over time, and
• has a program recorded therein, the program causing the processor to execute:
• selecting one first table from among the plurality of first tables,
• modifying a control parameter to control the device with the respective first modification values corresponding to the selected first table and the second modification values corresponding to the at least one second table, thereby calculating a modified parameter, and
• controlling the device based on the modified parameter, wherein
• each first modification value has a shorter term for modifying the control parameter than the second modification values,
• each first modification value moderates variation occurring in a processing result of the substrate after restart of the processing of the substrate due to stop of the processing of the substrate by the device,
• the plurality of first tables include at least a table including a first modification value to be used when the processing of the substrate has been stopped for a time shorter than a predetermined time, a table including a first modification value to be used when the processing of the substrate has been stopped for a time longer than the predetermined time, and a table including a first modification value to be used when a cleaning and pre-coat are performed just before the processing of the substrate is started, and
• each first modification value is used for modifying the control parameter to suppress an increase of a film thickness over time based on the restart of the processing, and
• each second modification value is used for modifying the control parameter in order to suppress a decrease of a film thickness over time in a case where the processing of the substrate is performed after the cleaning and pre-coat resets the decrease of the film thickness.