Composite copper foil and method of fabricating the same
AssigneeCircuit Foil Luxembourg
InventorsZainhia Kaidi, Thomas Devahif, Adrien Kersten, Michel Streel
Life of this patent
Estimating the term…
Abstract
A composite copper foil contains a carrier layer, a release layer and an ultra-thin copper layer in this order. In the composite copper foil, the release layer includes a binary alloy or a ternary alloy comprising nickel, and is formed into an amorphous layer, and the ultra-thin copper layer is peelable from the carrier layer. A method of fabricating the composite copper foil includes preparing a carrier layer, forming a release layer which is amorphous on the carrier layer by electroplating using an electrolyte that comprises nickel, and forming an ultra-thin copper layer on the release layer by electroplating.
Claims17
A composite copper foil comprising a carrier layer, a release layer and an ultra-thin copper layer in this order,
- wherein the release layer comprises a ternary alloy comprising nickel, molybdenum and tungsten, and is an amorphous layer, and
- the ultra-thin copper layer is peelable from the carrier layer,
- wherein the release layer shows a broad pattern in terms of a diffraction peak when measured by grazing incidence X-ray diffraction, or shows a halo pattern in an electron beam diffraction pattern when measured by a transmission electron microscope.
Dependencies are inferred from the claim text.