Jet impingement cooling for high power semiconductor devices
AssigneeSemiconductor Components Industries, LLC
InventorJesse Emmett Galloway
Life of this patent
Estimating the term…
Abstract
A jet impingement cooling assembly for semiconductor devices includes a heat exchange base having an inlet chamber and an outlet chamber. An inlet connection may be in fluid connection with the inlet chamber, while an outlet connection may be in fluid connection with the outlet chamber. A jet plate may be coupled to the inlet chamber, and a jet pedestal may be formed on the jet plate and having a raised surface with a jet nozzle formed therein.
Claims18
A jet impingement cooling assembly for semiconductor devices, comprising:
- a heat exchange base having an inlet chamber and an outlet chamber;
- an inlet connection in fluid connection with the inlet chamber;
- an outlet connection in fluid connection with the outlet chamber;
- a jet plate coupled to the inlet chamber;
- and
- a jet pedestal formed on the jet plate and having a raised surface with a jet nozzle formed therein, wherein the jet pedestal has a first configuration on the jet plate, and further wherein the jet plate is interchangeable within the heat exchange base with a second jet plate with at least a second jet pedestal having a second configuration.
A jet plate assembly for jet impingement cooling of a semiconductor device, comprising:
- a jet plate configured to be received within a heat exchange base;
- and
- a jet pedestal formed on the jet plate and having at least one jet nozzle formed within a raised surface that is raised from the jet plate surface by at least one jet pedestal wall connecting the jet plate to the raised surface,
- wherein the jet plate, when received within the heat exchange base, defines a fluid flow path from an inlet chamber of the heat exchange base through the jet nozzle, and through a return path defined by the at least one jet pedestal wall to an outlet chamber of the heat exchange base,
- wherein the jet pedestal has a first configuration on the jet plate, and further wherein the jet plate is interchangeable within the heat exchange base with a second jet plate with at least a second pedestal having a second configuration.
A method of making a jet impingement cooling assembly for semiconductor devices, comprising:
- forming a heat exchange base having an inlet chamber and an outlet chamber, including forming the inlet chamber with a mounting surface configured to be coupled to any of at least two interchangeable jet plates, including at least a first jet plate and a second jet plate;
- forming an inlet connection in fluid connection with the inlet chamber;
- and
- forming an outlet connection in fluid connection with the outlet chamber, wherein the first jet plate includes a first jet pedestal having a first configuration on the first jet plate, and the second jet plate includes a second pedestal having a second configuration on the second jet plate.
Dependencies are inferred from the claim text.