Exposure apparatus, exposure method, and article manufacturing method
AssigneeCanon Kabushiki Kaisha
InventorAkio Akamatsu
Life of this patent
Estimating the term…
Abstract
The control unit controls the relative position in an optical axis direction of the projection system and the relative position in a direction perpendicular to an optical axis direction at a third timing after a second timing based on a first distribution of illumination light detected by the detection system at a first timing and a second distribution of illumination light detected by the detection system at the second timing after the first timing, the illumination light detected at the first and second timings having passed through the first and second marks.
Claims20
An exposure apparatus comprising:
- a projection system configured to project a pattern of a mask on a substrate;
- a detection system including a detection unit configured to detect a light quantity distribution of illumination light having passed through a first mark, the projection system, and a second mark, the first mark being disposed on an object surface of the projection system, the second mark being disposed on an image plane of the projection system;
- and
- a control unit configured to control a relative position of the mask and the substrate,
- wherein the detection system detects a first light quantity distribution at a first timing, which is before an exposure process of exposing the pattern on the substrate and a second light quantity distribution at the second timing, which is after the exposure process, and
- wherein the control unit controls the relative position of the mask and the substrate in an optical axis direction of the projection system and the relative position of the mask and the substrate in a direction perpendicular to the optical axis direction based on the first light quantity distribution and the second light quantity distribution.
An exposure method of performing exposure processing to transfer a pattern of a mask onto a substrate, the exposure method comprising:
- detecting a light quantity distribution of illumination light having passed through a first mark, a projection system and a second mark, the first mark being disposed on an object surface of the projection system, the second mark being disposed on an image plane of the projection system;
- and
- controlling a relative position of the mask and the substrate,
- wherein the detecting detects a first light quantity distribution at a first timing, which is before an exposure process of exposing the pattern on the substrate and a second light quantity distribution at the second timing, which is after the exposure process, and
- wherein, in the controlling, the relative position of the mask and the substrate in an optical axis direction of the projection system and the relative position of the mask and the substrate in a direction perpendicular to the optical axis direction are controlled based on the first light quantity distribution and the second light quantity distribution.
Dependencies are inferred from the claim text.