Reflective mask blank, reflective mask and manufacturing method thereof, and semiconductor device manufacturing method
AssigneeHoya Corporation
InventorsYohei Ikebe, Tsutomu Shoki
Life of this patent
Estimating the term…
Loading patent…
AssigneeHoya Corporation
InventorsYohei Ikebe, Tsutomu Shoki
Estimating the term…
Provided is a reflective mask blank with which it is possible to further reduce the shadowing effect of a reflective mask, and also possible to form a fine and highly accurate phase-shift pattern. A reflective mask blank having, in the following order on a substrate, a multilayer reflective film and a phase-shift film that shifts the phase of EUV light, said reflective mask blank characterized in that the phase-shift film has a thin film comprising a metal-containing material that contains: ruthenium (Ru); and at least one element from among chromium (Cr), nickel (Ni), (Co), aluminum (Al), silicon (Si), titanium (Ti), vanadium (V), germanium (Ge), niobium (Nb), molybdenum (Mo), tin (Sn), tellurium (Te), hafnium (Hf), tungsten (W), and rhenium (Re).
A reflective mask blank comprising:
A reflective mask comprising:
A method of manufacturing a reflective mask, the method comprising that a phase shift pattern is formed by patterning a phase shift film of a reflective mask blank by a dry etching gas comprising a chlorine-based gas and an oxygen gas, wherein,
Dependencies are inferred from the claim text.