Microelectronic package communication using radio interfaces connected through wiring

A computing device comprising:

• a system board;
• a central processing unit (CPU);
• a package substrate mounted to the system board to carry the CPU, the package substrate having conductive connectors to connect the CPU to external components through the system board;
• a radio on the package substrate coupled to the CPU to modulate the data onto a carrier and to transmit the modulated data;
• a radio on the system board to receive the transmitted modulated data and to demodulate the received data;
• a cable interface coupled to the system board radio to couple the received demodulated data to a cable;
• a chipset carried by the system board coupled through the system board to the integrated circuit chip through the package;
• and
• an optical fiber modulator coupled to the radio to receive the demodulated data and to modulate the received demodulated data onto an optical fiber.

A computing device comprising:

• a system board;
• a central processing unit (CPU);
• a package substrate mounted to the system board to carry the CPU, the package substrate having conductive connectors to connect the CPU to external components through the system board;
• a radio on the package substrate coupled to the CPU to modulate the data onto a carrier and to transmit the modulated data;
• a radio on the system board to receive the transmitted modulated data and to demodulate the received data;
• a cable interface coupled to the system board radio to couple the received demodulated data to a cable;
• and
• a chipset carried by the system board coupled through the system board to the integrated circuit chip through the package, wherein the system board radio comprises a plurality of radio dies, the apparatus further comprising a dielectric substrate having a series of antennas each having a wiring element to connect to a respective radio die, each radio die being coupled to a respective cable.

An apparatus comprising:

• a system board;
• an integrated circuit chip package mounted to the system board having an integrated circuit chip, a radio and conductive connectors to connect the chip to the radio, the radio to modulate data from the chip onto a carrier and to transmit the modulated data away from the package, the radio further to receive modulated data, to demodulate the received data and to transmit the demodulated data to the chip;
• a radio on the system board to receive the transmitted modulated data and to demodulate the received data;
• a first cable interface on the system board to receive the transmitted demodulated data from the system board radio and to couple the received demodulated data into a cable;
• and
• a second cable interface coupled to the cable to connect the received demodulated data in the cable to a remote device.

A computing device comprising:

• a system board;
• a central processing unit (CPU);
• a package substrate mounted to the system board to carry the CPU, the package substrate having conductive connectors to connect the CPU to external components through the system board;
• a radio on the package substrate coupled to the CPU to modulate the data onto a carrier and to transmit the modulated data;
• a radio on the system board to receive the transmitted modulated data and to demodulate the received data;
• a cable interface coupled to the system board radio to couple the received demodulated data to a cable;
• a display coupled through the system board to the integrated circuit chip through the package;
• and
• an optical fiber modulator coupled to the radio to receive the demodulated data and to modulate the received demodulated data onto an optical fiber.

A computing device comprising:

• a system board;
• a central processing unit (CPU);
• a package substrate mounted to the system board to carry the CPU, the package substrate having conductive connectors to connect the CPU to external components through the system board;
• a radio on the package substrate coupled to the CPU to modulate the data onto a carrier and to transmit the modulated data;
• a radio on the system board to receive the transmitted modulated data and to demodulate the received data;
• a cable interface coupled to the system board radio to couple the received demodulated data to a cable;
• a graphic GPU carried by the system board coupled through the system board to the integrated circuit chip through the package;
• and
• an optical fiber modulator coupled to the radio to receive the demodulated data and to modulate the received demodulated data onto an optical fiber.