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US 11,518,101 B2Granted
Three-dimensional structure and method of manufacturing three-dimensional structure
AssigneeSony Corporation
InventorsAya Shuto, Kenichi Kurihara, Nobuhiro Kihara, Yusuke Kajio, Tomomasa Watanabe
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Abstract
A three-dimensional structure according to an embodiment of the present disclosure includes: a plurality of resin layers including a light curable resin, the light curable resin including a coloring compound, a color developing-reducing agent, and a photothermal conversion agent, the plurality of resin layers being stacked, the color developing-reducing agent having an average particle diameter of 10 μm or more and 100 μm or less.
Claims15
A three-dimensional structure comprising:
- a plurality of resin layers including a light curable resin, the light curable resin including a coloring compound, a color developing-reducing agent, and a photothermal conversion agent, the plurality of resin layers being stacked,
- the color developing-reducing agent having an average particle diameter of 10 μm or more and 100 μm or less.
A method of manufacturing a three-dimensional structure comprising:
- forming a film including a light curable resin as a resin layer, the light curable resin including a coloring compound, a color developing-reducing agent having an average particle diameter of 10 μm or more and 100 μm or less, and a photothermal conversion agent;
- and
- stacking a plurality of the resin layers.
Dependencies are inferred from the claim text.