Conformable heat sink interface with a high thermal conductivity

An integrated circuit package mounting assembly, comprising:

• an integrated circuit package coupled to a printed circuit board, the integrated circuit package comprising one or more dies attached to a substrate;
• a power supply coupled to the integrated circuit package through the printed circuit board;
• a heat sink;
• and
• a conformable heat sink interface between the integrated circuit package and the heat sink, the conformable heat sink interface comprising:
• a mounting plate having a first surface adjacent to a base of the heat sink;
• a deformable membrane having a portion thereof bonded to a second surface of the mounting plate, wherein a cavity is between the second surface of the mounting plate and the deformable membrane;
• and
• a flowable heat transfer medium within the cavity, wherein the deformable membrane is to conform to a three-dimensional shape of the integrated circuit package to enhance heat transfer between the integrated circuit package and the mounting plate, wherein the deformable membrane comprises a shape memory alloy and is embossed with one or more mesas, wherein the one or more mesas are aligned to the one or more dies such that the one or more dies are abutted by the one or more mesas.