US 11,464,108 B2 · Flexible substrate

Abstract

A flexible substrate includes a base substrate layer; and two patter layers laminated together on the front- and back-sides of the flexible substrate, on which electric circuit lines are printed each. In order to reduce a stress generated in the flexible substrate when it is folded and soldered to an optical communication semiconductor package, the flexible substrate has a thickness-wise concavely deformed portion in a lengthwise middle portion thereof. Also to reduce the stress, the flexible substrate having the deformed portion further has end sections and a middle section formed in its longitudinal direction, and the widths of the end sections are larger than that of the middle section, and the flexible substrate having the deformed portion further has holes and holes respectively formed near the side edges of a lengthwise middle section thereof.

Claims6

Dependent claims

A flexible substrate comprising:

a base substrate layer formed of an insulation material;
a front-side pattern layer on a front-side of the base substrate layer, on which pattern layer electric circuit lines are printed;
and
a back-side pattern layer on a back-side of the base substrate layer, on which pattern layer electric circuit lines are printed,
wherein the base substrate layer, the front-side pattern layer, and the back-side pattern layer are laminated together, and the flexible substrate has a deformed portion deformed concavely in a thickness direction of the flexible substrate, and
wherein widths of both end sections of the flexible substrate are larger than a width of a lengthwise middle section of the flexible substrate.

3 more elements

Dependencies are inferred from the claim text.

Flexible substrate

Life of this patent

Flexible substrate

Life of this patent

Abstract

Claims6