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US 11,456,221 B2Granted
Method for measuring chips bonding strength and chips bonding auxiliary structure
AssigneeUnited Microelectronics Corp.
InventorsSheng Zhang, Chien-Kee Pang, Xin Zhao
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Abstract
A method for measuring chips bonding strength includes steps as follows: An auxiliary pattern is formed on a first surface of a first chip. A second surface of a second chip is bonded to the first surface to form at least one gap space surrounding the auxiliary pattern. Next, dimensions of the at least one gap space and the auxiliary pattern are measure respectively; and the bonding strength between the first chip and the second chip is estimated according to the dimensions.
Claims12
A method for measuring chips bonding strength, comprising:
- forming an auxiliary pattern on a first surface of a first chip;
- bonding a second surface of a second chip to the first surface to form at least one gap space surrounding the auxiliary pattern;
- measuring dimensions of the at least one gap space and the auxiliary pattern respectively;
- and
- estimating the bonding strength between the first chip and the second chip according to the dimensions.
2 more elements
Dependencies are inferred from the claim text.