Method of processing workpiece
AssigneeDisco Corporation
InventorYoshinobu Saito
Life of this patent
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Abstract
A method of processing a workpiece includes a thermosetting step of heating an area of an expandable sheet around a workpiece to a predetermined temperature or higher and thereafter cooling the heated area of the expandable sheet to make the area harder than before the area has been heated, and after the thermosetting step, an expanding step of expanding the area of the expandable sheet around the workpiece in planar directions to divide the workpiece into chips or to increase distances between the adjacent chips.
Claims7
A method of processing a plate-shaped workpiece that has division initiating points formed therein along projected dicing lines thereon or that has been divided into a plurality of chips, the workpiece being disposed in an opening of an annular frame and supported on an expandable sheet having a thermosetting material and fixed directly to the annular frame, thereby making up a frame unit, the expandable sheet capable of being expanded to divide the workpiece into individual chips from the division initiating points or to increase distances between the adjacent chips, the method comprising:
- a thermosetting step of heating an area of the expandable sheet around the workpiece to a predetermined temperature or higher and thereafter cooling the heated area of the expandable sheet to harden the area of the expandable sheet around the workpiece;
- and
- after the thermosetting step, an expanding step of expanding the area of the expandable sheet around the workpiece in planar directions to divide the workpiece into the chips or to increase distances between the adjacent chips,
- wherein the thermosetting step limits an expansion of the hardened area of the expandable sheet around the workpiece relative to an area of the expandable sheet on which the workpiece is disposed.
Dependencies are inferred from the claim text.