Substrate inspection device that inspects application quality of adhesive

A substrate inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder and a thermosetting adhesive applied on the substrate, the substrate inspection device comprising:

• a mounting table that comprises a motor and that can move the substrate placed on the mounting table in a horizontal direction;
• an illumination device that irradiates the solder and the adhesive on the substrate with light;
• an imaging device that takes an image of the irradiated solder and the irradiated adhesive and outputs the image;
• and
• a control device that is electrically connected to and controls the motor, the illumination device, and the imaging device, and that is configured to:
• generate:
• actual solder position information of a solder group that includes two or more solders and on which the electronic component is mounted based on the image, received from the imaging device, that was taken while the mounting table is moving the substrate;
• ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of each of the solders;
• and ideal adhesive inspection reference information indicating a reference inspection position and/or a reference inspection range of the adhesive, wherein the ideal solder inspection reference information and the ideal adhesive inspection reference information are based on design data or manufacturing data stored in a storage, and the adhesive has a curing temperature higher than a melting temperature of the solders,
• inspect each of the solders based on actual inspection reference information obtained by shifting the ideal solder inspection reference information by mounting position adjustment information, while inspecting the adhesive based on the ideal adhesive inspection reference information, and
• upon determining that a printing state of the solders and an application state of the adhesive do not meet a predetermined condition, output, to the component mounting machine, the actual inspection reference information and upon determining that at least one of the printing state and the application state meet the predetermined condition, output, to the component mounting machine, at least one of a printing failure signal, an application failure signal, and failed soldering signal, wherein
• the mounting position adjustment information indicates an amount and direction of positional misalignment of an expected mounting position information, and
• the expected mounting position information indicates an expected mounting position of the electronic component relative to an ideal mounting position information that indicates an ideal mounting position of the electronic component mounted on the solder group.