Patch substrate configured as a shield located over a cavity of a board
AssigneeQUALCOMM Incorporated
InventorsCharles David Paynter, Ryan Lane, John Eaton, Amit Mano
Life of this patent
Estimating the term…
Abstract
A device that includes a board, a package and a patch substrate. The board includes a cavity. The package is coupled to a first side of the board. The package includes a substrate and an integrated device coupled to the substrate. The integrated device is located at least partially in the cavity of the board. The patch substrate is coupled to a second side of the board. The patch substrate is located over the cavity of the board. The patch substrate is configured as an electromagnetic interference (EMI) shield for the package.
Claims23
A device comprising:
- a board comprising a cavity;
- a package coupled to a first side of the board, the package comprising:
- a substrate;
- and
- an integrated device coupled to the substrate, wherein the integrated device is located at least partially in the cavity of the board;
- and
- a patch substrate coupled to a second side of the board,
- wherein the patch substrate is located over the cavity of the board, and
- wherein the patch substrate is configured as an electromagnetic interference (EMI) shield for the package,
- wherein the patch substrate includes a plurality of shield interconnects that are configured as an EMI shield for the integrated device, and
- wherein the plurality of shield interconnects that are configured as the EMI shield for the integrated device include at least one shield interconnect that is located over a back side of the integrated device.
An apparatus comprising:
- a printed circuit board comprising a cavity;
- a package coupled to a first side of the printed circuit board, the package comprising:
- a substrate;
- and an integrated device coupled to the substrate,
- wherein the integrated device is located at least partially in the cavity of the printed circuit board;
- and
- means for patch shield coupled to a second side of the printed circuit board,
- wherein the means for patch shield includes a plurality of shield interconnects that are configured as an electromagnetic interference (EMI) shield for the integrated device located at least partially in the cavity of the printed circuit board,
- wherein at least a portion of the means for patch shield is located over the cavity of the printed circuit board such that the integrated device is located between the substrate and the means for patch shield, and
- wherein the means for patch shield is configured as the EMI shield over a back side of the integrated device of the package.
A method for fabricating a device comprising:
- coupling a package to a first side of a board comprising a cavity, the package comprising:
- a substrate;
- and
- an integrated device coupled to the substrate, wherein the integrated device is located at least partially in the cavity of the board;
- and
- coupling a patch substrate to a second side of the board such that the patch substrate is located over the cavity of the board, wherein the patch substrate is configured as an electromagnetic interference (EMI) shield for the package,
- wherein the patch substrate includes a plurality of shield interconnects that are configured as an EMI shield for the integrated device, and
- wherein the plurality of shield interconnects that are configured as the EMI shield for the integrated device include at least one shield interconnect that is located over a back side of the integrated device.
Dependencies are inferred from the claim text.