Liquid submersion cooled server module assemblies and server systems that include the server module assemblies

A server system, comprising:

• a rack;
• a plurality of liquid submersion cooled servers;
• a first group of the liquid submersion cooled servers mounted on the rack;
• a first power shelf mounted on the rack and electrically connected to the first group of the liquid submersion cooled servers to provide electrical power to the first group;
• a second group of the liquid submersion cooled servers mounted on the rack below the first group;
• and a second power shelf mounted on the rack below the first group and below the first power shelf, the second power shelf is electrically connected to the second group of liquid submersion cooled servers to provide electrical power to the second group,
• wherein the first group of the liquid submersion cooled servers and the second group of the liquid submersion cooled servers each comprises:
• a plurality of server module assemblies, each one of the server module assemblies includes:
• a module chassis that is configured to mount the plurality of liquid submersion cooled servers of a respective one of the first and second groups thereon, the module chassis includes a front side and a rear side, and power connectors disposed at the rear side of the module chassis;
• a bus bar connector strip disposed at the rear side of the module chassis, the bus bar connector strip includes bus bar electrical connectors spaced from one another along a length of the bus bar connector strip, and each bus bar electrical connector is electrically connected to at least two of the power connectors;
• and
• the plurality of liquid submersion cooled servers of the respective one of the first and second groups mounted on the module chassis, each of the liquid submersion cooled servers includes:
• a housing defining an interior space and having a front wall and a rear wall, a heat generating electronic computing component within the interior space, a dielectric cooling liquid within the interior space and submerging, and in direct contact with, the heat generating electronic computing component, and a server power connector connected to the rear wall and configured to blind mate connect with a respective one of the power connectors of the module chassis, whereby each one of the server power connectors directs electrical power into the interior space of a corresponding one of the liquid submersion cooled servers for powering the heat generating electronic computing component,
• wherein one of the bus bar electrical connectors is electrically connected with the server power connectors of a first one and a second one of the liquid submersion cooled servers each blind mated to a respective one of the power connectors that is electrically connected with the one of the bus bar electrical connectors,
• wherein another one of the bus bar electrical connectors is electrically connected with the server power connectors of a third one and a fourth one of the liquid submersion cooled servers each blind mated to a respective another one of the power connectors that is electrically connected with the another one of the bus bar electrical connectors, and
• wherein the one of the bus bar electrical connectors is configured for powering the first and second ones of the liquid submersion cooled servers in parallel with the another one of the bus bar electrical connectors configured for powering the third and fourth ones of the liquid submersion cooled servers.

A server module assembly, comprising:

• a module chassis that is configured to mount a plurality of liquid submersion cooled servers thereon, the module chassis includes a front side and a rear side, and power connectors disposed at the rear side, the power connectors are aligned with one another along a horizontal axis;
• a bus bar connector strip disposed at the rear side of the module chassis, the bus bar connector strip is oriented vertically along a vertical axis that is perpendicular to the horizontal axis, the bus bar connector strip includes bus bar electrical connectors spaced from one another along a length of the bus bar connector strip;
• and
• the plurality of liquid submersion cooled servers mounted on the module chassis, each of the liquid submersion cooled servers includes:
• a housing defining an interior space and having a front wall and a rear wall, a heat generating electronic computing component within the interior space, a dielectric cooling liquid within the interior space and submerging, and in direct contact with, the heat generating electronic computing component, and a server power connector connected to the rear wall and configured to blind mate connect with a respective one of the power connectors of the module chassis, whereby each one of the server power connectors directs electrical power into the interior space of a corresponding one of the liquid submersion cooled servers for powering the heat generating electronic computing component,
• wherein one of the bus bar electrical connectors is electrically connected with the server power connector of a first one of the liquid submersion cooled servers blind mated to a respective one of the power connectors that is electrically connected with the one of the bus bar electrical connectors, and
• wherein another one of the bus bar electrical connectors is electrically connected with the server power connector of a second one of the liquid submersion cooled servers blind mated to a respective another one of the power connectors that is electrically connected with the another one of the bus bar electrical connectors, and
• wherein the one of the bus bar electrical connectors is configured for powering the first one of the liquid submersion cooled servers in parallel with the another one of the bus bar electrical connectors configured for powering the second one of the liquid submersion cooled servers.