Method for enhancing boiling performance of chip surface

A method for enhancing boiling performance of chip surface, characterized in that, comprising steps of mounting a heat pipe directly above a surface of a chip;

• forming a porous structure for increasing a vaporization core on an upper surface of an outer wall surface of the heat pipe,
• the heat pipe is a flat heat pipe, and
• the porous structure is formed by a method of sintering metal particles, the method of sintering metal particles comprising:
• removing rust and grease from the upper surface of the outer wall surface of the heat pipe:
• applying a layer of adhesive solution including polypropylene, polyethylene, polystyrene, polyethylene terephthalate, polymethacrylic acid, acetone or xylene to the upper surface of the outer wall surface of the heat pipe;
• applying a metal powder evenly to the upper surface of the outer wall surface of the heat pipe to form a metal powder surface;
• after drying the adhesive solution, placing the heat pipe in a sintering furnace to heat to a temperature at which the metal powder surface tends to melt under protection of hydrogen, remaining the temperature for about 20 minutes to disperse and volatilize the adhesive such that the metal powder is sintered into one body and sintered on the upper surface of the outer wall surface of the heat pipe, thereby forming the porous structure, the porous structure having a thickness less than 3 mm, and a porosity of 40%-65%.