Liquid cooling interconnect module of a computing system
AssigneeHewlett Packard Enterprise Development LP
InventorsChong S. Tan, Joseph Allen, Kai Zhang
Life of this patent
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AssigneeHewlett Packard Enterprise Development LP
InventorsChong S. Tan, Joseph Allen, Kai Zhang
Estimating the term…
Example implementations relate to a liquid cooling interconnect module of a computing system, and a tool-less method of assembling the liquid cooling interconnect module having a housing, a biasing member, and an interconnect block. The housing has an interlocking member, a support assembly, and a bore extending between a first end and a second end of the housing. The biasing member is disposed within the bore such that it contacts the support assembly. The interconnect block having a pair of through openings, is configured to be slidably inserted within the bore such that it contacts the biasing member. Further, the interconnect block is configured to compress the biasing member against the support assembly to a compressed position when the interconnect block is inserted into the bore, and the interlocking member is configured to retain the interconnect block within the housing when the biasing member is in the compressed position.
A liquid cooling interconnect module for a liquid cooling assembly of a computing system, comprising:
A liquid cooling assembly of a computing system, comprising:
A method of assembling a liquid cooling interconnect module of a liquid cooling assembly for a computing system, comprising:
Dependencies are inferred from the claim text.