Device for cooling high-performance computers or high-performance circuits, with temperature control

A device for cooling one or several high-performance computers or circuits located in one or more housings and comprising a dual-circuit cooling system, wherein the high-performance computers or circuits are dipped into a dielectric first cooling liquid in a cuboid basin with a completely fluid-tight configuration and a first cooling circuit with a pump is arranged in the basin for the circulation of the first cooling liquid, with the first cooling liquid being forced to flow through the housings of the high-performance computers or circuits during circulation, wherein, in the basin, a heat exchanger, a forward flow and a return flow of a second cooling circuit with the second cooling liquid are accommodated, wherein the heat exchanger is dipped into the first liquid and the first cooling liquid is cooled by a second cooling liquid, wherein an insert-like intermediate floor is introduced into the basin and is configured to be lifted into the basin, which intermediate floor divides the basin into a floor space located below and a main space located above the floor space, and the intermediate floor as an insert is provided with one or more feet, with the feet being respectively attached in the edge regions of the intermediate floor, thus forming respective recesses between the edges of the basin and the edges of the intermediate floor so that the first cooling liquid can flow freely from the main space to the floor space through the recesses, and the intermediate floor has one or more bore-like apertures which allow the first cooling liquid to flow back from the floor space to the main space, wherein conduits are connected to the heat exchanger, with those conduits being guided from the heat exchanger toward the outside of the basin without thereby breaking through the walls or the floor of the basin, wherein they are guided particularly preferably across at least one of the edges of the basin, and the pump and the housing or housings of the high-performance computers or circuits are positioned on the intermediate floor, the pump and, respectively, the housings being arranged in the main space of the basin, and at least one suction hole is provided in the intermediate floor, with a tubular line connector leading from the suction hole to the pump and from there further on to a distributor for the first cooling liquid, and further line connectors lead from the distributor to one or several connection adapters, the connection adapters being arranged on the housings of the high-performance computers or circuits at the inlet side.