Back to results
US 11,452,228 B2Granted
Driver
AssigneeMitsuba Corporation
InventorsTakahiko Ogane, Fumiaki Koshio, Hiroyuki Hirano, Hirokazu Takada
Life of this patent
Estimating the term…
Abstract
A driver is provided. A driver (1) includes an aluminum substrate (10) to which electronic components (13) are joined, and a resin member (20) that covers the electronic components (13). The resin member (20) has a first resin portion (21) that covers the electronic components (13) and a second resin portion (22) that covers the first resin portion (21). The hardness of the first resin portion (21) is lower than the hardness of the second resin portion (22).
Claims17
A driver comprising:
- a substrate to which an electronic component is joined;
- a resin member that covers the electronic component,
- wherein the resin member comprises a first resin portion that covers the electronic component and a second resin portion that covers the first resin portion, and a hardness of the first resin portion is lower than a hardness of the second resin portion;
- and
- a housing having a storage portion which takes a frame body as a side wall and the substrate arranged inside an inner peripheral surface of the frame body as a bottom wall, and
- the first resin portion and the second resin portion are filled in the storage portion., and
- wherein a side surface of the substrate is coated with an adhesive, which is insulating, and
- wherein the frame body comprises a receiving portion which projects inward from the inner peripheral surface and on which the substrate is arranged, and a groove portion which is arranged on the receiving portion along the inner peripheral surface and on which the adhesive is arranged.
5 more elements
Dependencies are inferred from the claim text.