Printed circuit board

A method for manufacturing a printed circuit board with multiple electrically conductive layers which are separated from each other by electrically non-conductive layers, comprising the steps of:

• providing at least one electrically conductive outer layer and multiple electrically conductive intermediate layers,;
• providing at least one first electrically conductive through-connection between the at least one electrically conductive outer layer and one of the multiple electrically conductive intermediate layer, wherein the first electrically conductive through-connection includes an electrically conductive sleeve and a sealed end,
• providing at least a first multilayer PCB and a second multilayer PCB, where the first multilayer PCB and the second multilayer PCB are connected to each other via an adhesive enriched layer directly between the first multilayer PCB and the second multilayer PCB, the adhesive enriched layer comprising a filer material;
• forming the first multilayer PCB from multiple first ones of the electrically conductive layers including a first electrically conductive outer layer and a first electrically conductive intermediate layer;
• forming the second multilayer PCB from multiple second ones of the electrically conductive layers including a second electrically conductive outer layer and a second electrically conductive intermediate layer, and at least one of the electrically non-conductive layer;
• providing the adhesive enriched layer in fluid communication with the first electrically conductive through-connection of the first multilayer PCB;
• positioning the second PCB to close off the first electrically conductive through-connection directly at the adhesive enriched layer to creat the sealed end;
• and
• filling the electrically conductive sleeve with the filler material such that the filler material of the adhesive enriched layer extends up into the electrically conductive sleeve.

A printed circuit board comprising:

• multiple electrically conductive layers separated from each other by electrically non-conductive layers, said multiple electrically conductive layers including at least one electrically conductive outer layer and multiple electrically conductive intermediate layers;
• a first electrically conductive through-connection between the at least one electrically conductive outer layer and one of the multiple electrically conductive intermediate layer, wherein the first electrically conductive through-connection includes an electrically conductive sleeve;
• the printed circuit board includes at least a first multilayer PCB and a second multilayer PCB, where the first multilayer PCB and the second multilayer PCB are connected to each other;
• the first multilayer PCB is formed from multiple electrically conductive layers including a first electrically conductive outer layer and a first electrically conductive intermediate layer, and multiple electrically non-conductive layers;
• and
• the second multilayer PCB is formed from multiple electrically conductive layers including a second electrically conductive outer layer and a second electrically conductive intermediate layer, and at least one electrically non-conductive layer,
• wherein the first electrically conductive through-connection of the first multilayer PCB is in fluid communication with an adhesive enriched layer consisting of a filler material, and the adhesive enriched layer is positioned directly between the first multilayer PCB and the second multilayer PCB,
• wherein the electrically conductive sleeve is filled with the filler material of the adhesive enriched layer.